The microme|x is a high-resolution

Submicron  X-ray system for the

inspection of solder joints  and

electronic components.

Equipped with the fully automated µAXI inspection software x|act, the microme|x offers fast and easy CAD programming as well as highest defect coverage and repeatability.

Possible applications include:

• Power Electronics
• Mounted PCB’s
• Semiconductors and other electronic components

Special features:

• Max. inspection area of 24 x 22
• Detail detectability of <1µ
• Max. tube voltage of 180 kV / 20W
• Automated voiding calculation for multi-chip modules
• Real-time detector resolution of 2 megapixel
• 24" TFT display
• Max. magnification up to 23.320x
• Automated X-ray inspection of BGAs, CSPs, QFPs, QFNs, PTHs, Voiding Calculation, Wire Sweep
• Low-maintenance, long-life (open) submicron X-ray tube
• Ergonomically designed control panel
• Steplessly adjustable projection angle up to 70°, rotation 0°-360°
• Easy-view-configuration: The X-ray image shows the object exactly as the operator sees it through the radiation protection window.
• optional with CT upgrade available
• optional with CAD based µAXI inspection software x|act