




|
Product Number |
Grain Size (melting point) |
Application |
|
|
S3X48- |
Sn96.5/Ag3/Cu0.5 (217-
|
General purposes Super low void Robust performance & stability of properties over days of continual use |
(637KB) |
|
S3X48- |
General purposes Anti- Excellent printability | ||
|
S3X48- |
Halogen free ICT testable For high speed print | ||
|
S3X48- |
Halogen free Good wetting Outstanding printing | ||
|
S3X70- |
For Super fine pitch (0402 Chip) Grain size: 10~25um | ||
|
SB6N58- |
Sn90/Ag3.5/Bi0.5/In6 (202- |
Medium melting point Anti- | |
|
TB48- |
Sn42/Bi58 (138°C) |
Low melting point Anti- (Reduce the emissions of CO2) |
|
Product |
Non- |
Application |
|
|
JS- |
4.0 |
All round liquid flux Excellent total balance | |
|
JS- |
2.8 |
Excellent thru- Low flux residue Applicable for a short soldering machine | |
|
JS- |
7.1 |
Applicable for selective soldering Few solder balls | |
|
JS- |
8.0 |
Powerful solderability Excellent thru- Few solder balls | |
|
JS- |
5.0 |
VOC free product Extremely low flux residue | |
|
JS- |
4.5 |
VOC free product Extremely low flux residue Improved solderability |
(coming soon) |
|
JS- |
2.7 |
Halogen free product Extremely low residue |
(coming soon) |
|
JS- |
14.6 |
Ensures excellent solderability No bridging, no skips and complete through hole fill |
(coming soon) |
|
Product |
Alloy composition |
Application |
|
|
SE48- |
Sn37Pb
Or
-
Sn36PbAg2 Sn36.8Pb0.4Ag0.2Sb (Anti-
|
General purposes | |
|
SE48- |
General purposes Low voiding | ||
|
SE58- |
High speed print Low voiding | ||
|
SE48- |
Powerful wetting | ||
|
SE48- |
ICT testable |
coming soon |
|
Product |
Solids content (%) |
Application |
|
|
JS- |
3.1 |
General purposes Low residue | |
|
JS- |
2.8 |
General purposes Rosin base | |
|
JS- |
2.8 |
Selective soldering VOC free (water base) | |
|
JS- |
7.2 |
General purposes Rosin base | |
|
JS- |
14.8 |
General purposes Rosin base |