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Compact Reflow-MINIOVEN for a desktop

The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven: Gently and simultaneously from all sides and guarantees repeatable process results with high yield.  MINIOVEN 05 is perfect for use in both production and R&D environments.

     
Products
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Martin

Compact Reflow-MINIOVEN for a desktop

Martin

Family of hot gas reflow systems with high degree of automation

Martin

Low profile bottom heater for pre-warming of PCB

Martin

Manual rework of BGA, CSP, QFP and sockets
       
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