The TMT-PH300 uses advanced intelligent temperature control technology to control the infrared preheater. Three heating modes allow the unit to handle leaded & lead-free preheating processes and are suitable for use with PCB containing BGA and SMD components.
Microprocessor accurately regulates temperature.
Three heating modes to meet different soldering requirements.
Professional board holder allows three dimensional adjustments.
Large quartz heating element suitable for large sized PCBA.
Two external temperature sensors probes.
Hot Air Tool
The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.
Digital display shows temperature and status.
Airflow meter provides visual feedback of air flow.
Large selection of high quality nozzles.
Adjustable, easy to use temperature and air control knobs.
The TMT-2000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material