• Package bodies and lids • Substrate carriers • Microwave circuit supports • Heatsinks • Formed feed-throughs and lead-frames • Device mounts
hybrid integrated circuit
integrated semiconductor circuit
For Bonding Today, PLUS Tomorrow
IConnPSPLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.
IConnPLUS is designed to meet all leading edge wire bonding challenges.
Hybrids, Thin Film, LC filters, Substrates, MEMS
Standard and Customized solutions for microelectronic modules, packages and substrates for Hybrids, Thin Film, LC Fliters, MEMS, Power packages, Glass/Metal Sealed Packages, Microwave Housing
HENGLI firing and drying conveyor belt furnaces are widely used in SMT, solar cell (photovoltaic) manufacturing,semiconductor packaging, circuit board assembly, and advanced materials processing (thick film, thin film, metals, ceramics, and various electronic components), and noble metal annealing.
Hengli’s products are CE marked and fulfill the latest safety requirements. In more than twenty years, Hengli products have reached satisfied customers in the United States, Australia, Hungary, Italy, India, Singapore more than 20+ countries and regions. Customers include well respected corporations like IBM, NASA and The Royal Canadian Mint.
Contact Zetech for more information
Asterion Enhanced Capability Hybrid Wedge Bonder
The AsterionTM Wedge Bonder is
built on an enhanced architecture that includes an expanded bond area, new
robust pattern recognition capabilities and extremely tight process controls.
Together these deliver heightened productivity, bonding quality, and
reliability. The enlarged bondable area enhances flexibility and reduces line
integration costs. Asterion is driven by a precise new direct-drive motion
system that requires minimum maintenance and delivers high repeatability.
Powerful new software features, like the graphical editor, make programming
complex devices easier, and multi-segmented bonding includes flexible tools to
deliver an optimized bonding process.