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Products and Services

Metal packages for microelectronics industry

Products

• Package bodies and lids
• Substrate carriers
• Microwave circuit supports
• Heatsinks
• Formed feed-throughs and lead-frames
• Device mounts

Applications:

hybrid integrated circuit

  • integrated semiconductor circuit
  • mcrowaves
  • laser device
  • infrared detectors
  • fiber optics
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    Products
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    ADT- Advanced Dicing Technologies

    2 and 4 Inch Spindle Dicing System

    Kulicke & Soffa

    Asterion Enhanced Capability Hybrid Wedge Bonder

    Hengli Eletek

    Belt Furnaces for Solar, Hybrids and LTCC

    Various

    Hybrids, Thin Film, LC filters, Substrates, MEMS

    Kulicke & Soffa

    IConnPS PLUS

    Various

    Metal packages for microelectronics industry
       
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