The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.
Auto sleep activated when hot air tool is placed in the holder.
Lightweight and compact, takes up minimal table space.
Large selection of high quality nozzles.
Adjustable, easy to use temperature and air control knobs.
Three humidity control ranges: superlow humidity(1%-10%RH), low humidity(10%-20%RH), medium humidity(20%-60%RH); The capacity from 98L to 1436L: nine models selection. Special for camera equipment storage: 40-105L five models selection. Fully automatic Nitrogen cabinets and/or ESD options.
Low profile bottom heater for pre-warming of PCB
Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill.
MARTIN offers a wide choice of underheaters. They can be classified by size of the heater and heater performance. For small boards IR systems are available up to a power rating of 2.000W. For medium sized boards and above Hybrid heaters between 3.000 and 10.000 W are on offer.
Compact Reflow-MINIOVEN for a desktop
The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven: Gently and simultaneously from all sides and guarantees repeatable process results with high yield. MINIOVEN 05 is perfect for use in both production and R&D environments.
MX1000 / MX1500 Rod Displacement Meter Mix Systems
PVA’s MX1000 and MX1500 series rod displacement systems are ideal choices for meter-mix dispensing applications using heavily filled, abrasive materials. The rod displacement design eliminates metal to metal contact and does not contain wearable dynamic seals.